1156-BBGA, FCBGA

Q:What defines the physical structure of 1156-BBGA, FCBGA?

A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad: 10×10 mm coverage (80% area) for enhanced heat dissipation.
- 1156-pin layout: Staggered ball grid array (BGA) arrangement.
- Ultra-thin profile: 1.2 mm package height for space-constrained designs.

Q:Why choose 1156-BBGA, FCBGA over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than 1156-LGA.
- Thermal Performance: Direct PCB heat path via thermal vias (5×5 array).
- Electrical Benefits: Low-inductance (<0.5 nH) design for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 35×35 mm.
- Height: 1.2 mm (max).
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy balls with SnAgCu solder.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is 1156-BBGA, FCBGA typically applied?

A:Dominant use cases:
- High-performance computing: GPU/CPU power delivery (e.g., NVIDIA H100).
- Telecom infrastructure: 5G RF front-end modules (e.g., Qualcomm QPM56xx).
- Automotive ADAS: Sensor fusion controllers (e.g., NXP S32G).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 µm particle size) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).