모든 항목16-UQFN
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14KB FLASH 1K RAM 32MHZ INT. OSC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 570
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14KB FLASH 1K RAM 32MHZ INT. OSC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 169
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14KB FLASH 1K RAM 32MHZ INT. OSC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 47
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28KB 2KB RAM 256B EEPROM 10B ADC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 276
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14KB FLASH 1K RAM 32MHZ INT. OSC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 857
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14KB FLASH 1K RAM 32MHZ INT. OSC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 370
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14KB FLASH 1K RAM 32MHZ INT. OSC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 502
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14KB 1KB RAM 12X I/O 4XPWMS COMP
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 212
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7KB 512 B RAM 4XPWMS COMPARATOR
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 834
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7KB 512 B RAM 4XPWMS COMPARATOR
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 895
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IC MCU 8BIT 14KB FLASH 16UQFN
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 620
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IC MCU 8BIT 14KB FLASH 16UQFN
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1 + 10 + 25 + 50 + >=100 -
재고 : 1
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IC MCU 8BIT 7KB FLASH 16UQFN
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 666
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IC MCU 8BIT 7KB FLASH 16UQFN
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 100
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8 Bit MCU, PIC16 Microcontrollers, 32 MHz, 14 KB, 1 KB, 16 Pins, UQFN
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 680
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IC MCU 8BIT 14KB FLASH 16UQFN
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 83
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IC MCU 8BIT 7KB FLASH 16UQFN
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 547
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IC MCU 8BIT 7KB FLASH 16UQFN
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 641
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Current & Power Monitors & Regulators Triple High-Side Current Sensor, I2C/SMBus, 32V with Accumulator
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1 + 10 + 25 + 50 + >=100 -
재고 : 0
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Current & Power Monitors & Regulators Dual High-Side Current Sensor, I2C/SMBus, 32V with Accumulator
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 742
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Current & Power Monitors & Regulators Quad High-Side Current Sensor, I2C/SMBus, 32V with Accumulator
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 56000
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IC SWITCH LNB BIAS 16QFN
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 10000
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Q:What defines the physical structure of 16-UQFN?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (60% coverage) for enhanced heat dissipation.
- 16-pin layout with dual-row perimeter arrangement.
- 0.5 mm ultra-thin profile for space-constrained designs. -
Q:Why choose 16-UQFN over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOIC-16.
- Thermal Performance: Direct PCB heat path via exposed pad.
- Electrical Benefits: Low-inductance design for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0×3.0 mm.
- Height: 0.5 mm.
- Pin Pitch: 0.4 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is 16-UQFN typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2541).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (4×4 array recommended).
- Solder Paste: Type 4 solder for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad alignment verification.