28-LSSOP (0.220, 5.60mm Width)

Q:What defines the physical structure of 28-LSSOP?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: ~60% coverage (3.5mm × 3.5mm typical) for heat dissipation.
- 28-pin layout: Dual-row gull-wing leads with 0.65mm pitch.
- Ultra-thin profile: 1.2mm max height for space-constrained designs.

Q:Why choose 28-LSSOP over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller footprint than SOIC-28.
- Thermal Performance: Direct PCB heat path via exposed pad.
- Electrical Benefits: Low-inductance (<1nH) leadframe design.
- Reliability: Moisture-resistant (MSL3) substrate.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 7.8mm × 5.6mm.
- Height: 1.2mm (max).
- Pin Pitch: 0.65mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C.

Q:Where is 28-LSSOP typically applied?

A:Dominant use cases:
- Power Management: Buck converters (e.g., TI TPS5430).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., NRF52840).
- Sensor Interfaces: MEMS accelerometers (e.g., ADXL345).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.3mm diameter).
- Solder Paste: Type 4 (5–15µm particle size).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad void detection.