모든 항목2920
- 제품 이미지 & 모델
- 비고
- 단가
- 양
- 운영
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기타 구성 요소
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 9000
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PTC Resettable Fuse 0.75A(hold) 1.5A(trip) 60VDC 40A 1.5W 0.3s 0.18Ω SMD Solder Pad 7.98 X 5.44 X 1.15mm T/R
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 25000
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fuse
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 250
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fuse
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 12000
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fuse
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 12000
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fuse
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200000
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fuse
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 999000
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Current Fuse
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 5000
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Q:What defines the physical structure of 2920?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB integration.
- Central thermal pad (80% coverage) for efficient heat dissipation.
- 20-pin layout with dual-row perimeter arrangement.
- 1.0 mm ultra-thin profile for space-constrained designs. -
Q:Why choose 2920 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than standard QFN packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.9 × 2.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.4 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is 2920 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62933).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2652R).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Ramp rate: 2°C/s).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).