Axial
- 제품 이미지 & 모델
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- 단가
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HONEYWELL HAFBLF0200C5AX5 Mass Air Flow Sensor, Zephyr, Digital,, -200 cc/min, 200 cc/min, 25psi, 4.5V, 5.5V
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 53
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Rectifier Diode, 1 Phase, 1Element, 1.3A, 150V V(RRM), Silicon, HERMETIC SEALED, G102, 2Pin
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 600
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Rectifier Diode, 1Element, 1A, 600V V(RRM), Silicon, SIMILAR TO DO-41, 2Pin
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 409
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HONEYWELL HAFBLF0200C6AX5 Mass Air Flow Sensor, Zephyr, Digital,, -200 cc/min, 200 cc/min, 25psi, 4.5V, 5.5V
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 739
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HONEYWELL HAFBLF0200C7AX5 Mass Air Flow Sensor, Zephyr, Digital,, -200 cc/min, 200 cc/min, 25psi, 4.5V, 5.5V
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 102
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Rectifier Diode, 1 Phase, 1Element, 3A, 100V V(RRM), Silicon, SIMILAR TO DO-35, 2Pin
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 838
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JANTX Series 150V 30ns Through Hole Super Fast Rectifier Diode - AXIAL
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 857
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Q:What defines the physical structure of Axial?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad: 80% coverage for efficient heat dissipation.
- 4-pin layout with symmetrical arrangement: Balanced signal distribution.
- 1.2 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose Axial over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than traditional DIP packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<1nH) for high-frequency stability.
- Reliability: Moisture-resistant ceramic substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0×5.0 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is Axial typically applied?
A:Dominant use cases:
- Power Converters: E.g., Buck/boost modules (e.g., TPS5430).
- RF Modules: E.g., 2.4GHz transceivers (e.g., CC2541).
- Sensor Interfaces: E.g., MEMS accelerometers (e.g., ADXL345). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3mm diameter).
- Solder Paste: Type 4 solder with 88% metal content.
- Reflow Profile: Peak temp ≤ 245°C (Ramp rate: 2°C/sec).
- Inspection: X-ray (AXI) mandatory for void detection.



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