BGA-196

Q:What defines the physical structure of BGA-196?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB connections.
- Central thermal pad (70% coverage): Optimizes heat dissipation.
- 196-pin layout with perimeter + area array arrangement: Balances I/O density and routing flexibility.
- 1.2 mm ultra-thin profile: Saves vertical space in compact designs.

Q:Why choose BGA-196 over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by ~15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL-3 rated) for harsh environments.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 15×15 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy balls with SnAgCu solder
- Temp Range: -40°C to +125°C (industrial grade)

Q:Where is BGA-196 typically applied?

A:Dominant use cases:
- Networking: High-speed switches (e.g., Marvell Prestera® chips)
- Automotive: ADAS processors (e.g., NXP S32G2)
- Consumer Electronics: SoCs for 4K/8K TVs (e.g., MediaTek Pentonic)

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).