모든 항목LFBGA
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Embedded Processors & Controllers
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1 + 10 + 25 + 50 + >=100 -
재고 : 1
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MCUs and MPUs ; 78K Family ; UPD78034x
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1 + 10 + 25 + 50 + >=100 -
1
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MCUs and MPUs ; 78K Family ; UPD78002xA
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1 + 10 + 25 + 50 + >=100 -
1
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MCUs and MPUs ; V850 Family ; V850E2/Mx4
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 199
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MCUs and MPUs ; V850 Family ; V850E2/Mx4
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 169
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MCUs and MPUs ; V850 Family ; V850E2/Mx4
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 145
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MCUs and MPUs ; V850 Family ; V850E/IF3, V850E/IG3
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 65
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MCUs and MPUs ; V850 Family ; V850E/PHO3
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 90
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 290
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 915
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 106
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 156
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MCU 16Bit/32Bit TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 337Pin NFBGA Tube
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1 + 10 + 25 + 50 + >=100 -
1
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MCU 16Bit/32Bit TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 337Pin NFBGA Tray
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1 + 10 + 25 + 50 + >=100 -
1
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Intelligent central control
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 480
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Intelligent central control
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 480
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 844
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 10059
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1841
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 400
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ARM Microcontrollers - MCU Hi-perf 32b RISC MCU w/ USB cntrlr 16kB
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 50
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ST
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 12250
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8 Megapixel imaging processor
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 4846
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
1
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Single chip 802.11b/g WLAN radio
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 8000
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ST
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 56
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ST
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 2500
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ST
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 30000
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ST
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 562
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Multimedia Misc MPEG 2.5 LAYER III AUDIO DECODER
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1750
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Audio DSPs MPEG Audio Decoder
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 28
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 5270
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
1
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 4268
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 685
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 3600
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
1
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멀티미디어 IC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 413
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Standard set top box
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 25
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Standard set top box
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 108
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멀티미디어 IC
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 339
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ARM Microcontrollers - MCU 128K RAM 0K Flash
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1 + 10 + 25 + 50 + >=100 -
1
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 674
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
재고 : 1
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 792
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32-Bit System-on-Chip,Microcontrollers (MCU) LCD USB FS/HOST MMU LFBGA324
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 210
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System-on-Chip
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최소 : 1 재고 : 210
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 21
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집적 회로 (IC)
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 48
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Single-chip Universal Serial Bus On-The-Go controller
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 100
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Q:What defines the physical structure of LFBGA?
A:Key features include:
- Leadless bottom-mounted pads: Solder balls replace traditional leads for compactness.
- Central thermal pad: Enhances heat dissipation (typically 70–90% coverage of the package base).
- High-density pin layout: Ranging from 36-pin to 324-pin with staggered/peripheral ball arrangements.
- Ultra-thin profile: Typical height of 0.8–1.4 mm, ideal for space-constrained designs. -
Q:Why choose LFBGA over alternatives?
A:Critical advantages:
- Miniaturization: 40–60% smaller footprint than equivalent QFP/TQFP packages.
- Thermal Performance: Direct PCB heat path via thermal balls and exposed die-attach pad.
- Electrical Benefits: Low-inductance (<0.5 nH) and short signal paths for high-speed applications.
- Reliability: Halogen-free substrates with MSL 3 (moisture resistance) and robust drop-test performance. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: Ranges from 4×4 mm to 15×15 mm.
- Height: 0.8–1.4 mm (varies by ball count).
- Ball Pitch: 0.5 mm or 0.65 mm (fine-pitch options available).
- Material: Copper-alloy balls with SnAgCu (SAC) solder.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is LFBGA typically applied?
A:Dominant use cases:
- Mobile Devices: Processors/SOCs (e.g., Qualcomm Snapdragon).
- Networking: High-speed transceivers (e.g., Xilinx FPGAs).
- Automotive: ECU modules (e.g., NXP S32G).
- IoT: Compact sensor hubs (e.g., STMicro BLE chips). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4–6 thermal vias under the central pad; NSMD pads for ball attachment.
- Solder Paste: Type 4 (20–38 µm) for fine-pitch balls.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free) with 60–90 sec above 217°C.
- Inspection: X-ray (AXI) mandatory for hidden joint defects; optical post-reflow checks.