QFP-48
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Q:What defines the physical structure of QFP-48?
A:Key features include:
- Leaded design: Gull-wing leads for robust PCB attachment.
- High pin density: 48-pin layout with perimeter arrangement.
- Compact body: Standard square footprint for space-constrained designs.
- Low profile: Typical height of 1.0–1.2 mm for slim applications. -
Q:Why choose QFP-48 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than equivalent DIP-48 packages.
- Thermal Performance: Balanced heat dissipation via leadframe design.
- Electrical Benefits: Low-inductance leads for high-frequency signals.
- Reliability: Moisture-resistant (MSL3-rated) epoxy molding compound. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 7×7 mm (±0.2 mm tolerance).
- Height: 1.0 mm (nominal).
- Pin Pitch: 0.5 mm (fine-pitch variant available).
- Material: Copper-alloy leads with Sn/Pb or lead-free plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is QFP-48 typically applied?
A:Dominant use cases:
- Embedded Systems: Microcontrollers (e.g., STM32F4 series).
- Communication: Ethernet PHY chips (e.g., DP83848).
- Consumer Electronics: Display drivers (e.g., SSD1963). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 0.1mm solder mask clearance for lead coplanarity.
- Solder Paste: Type 3 or 4 for fine-pitch reflow.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free) with 60–90 sec above 217°C.
- Inspection: AOI (Automated Optical Inspection) for lead alignment.



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