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10dB 180°@±10° 2.3GHz~2.69GHz 0.55dB 50Ω:100Ω SMD Balun ROHS
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 7975
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Board Mount Pressure Sensors MEMS I2C 300-1100hPa 1.7-3.6V 1.8pf
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 5909
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Board Mount Humidity Sensors Mod PCB 13x30x10mm 5V w/ Humiseal coat
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 9767
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The linear Hall IC TLE4998S8D has been designed specifically to meet the requirements of highly accurate angle and position detection. The sensor provides a digital SENT signal based on the SAE J2716 standard, which consists of a sequence of pulses. Each transmission consists of multiple data nibbles containing the Hall value, the temperature and status information of the sensor. The output stage is an open-drain driver pulling the output pin to low only. Therefore, the high level needs to be obtained by an external pull-up resistor. This output type has the advantage that the receiver may use an even lower supply voltage (e.g. 3.3 V). In this case the pull-up resistor must be connected to the given receiver supply.
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 7735
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The linear Hall IC TLE4998C8D has been designed specifically to meet the requirements of highly accurate angle and position detection. The sensor provides a digital SPC (Short PWM Code) signal, based on the standardized SENT (Single Edge Nibble Transmission, SAE J2716) protocol. The SPC protocol allows transmissions initiated by the ECU.Two further operation modes are available:• “range selection” for dynamically switching of the measurement range during operation• “ID selection” to build a bus system with up to 4 IC’s on a single output line and a common supply, which can be individually accessed by the ECUISCM-SENT Infineon TLE4998xThe CompactRIO ISCM-SENT (Infineon) module developed by CGS can sequentially calibrate up to 2 Infineon TLE4998x sensors with 2 channels each. In addition, the module can read the SENT signals in parallel on the 4 channels.
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 8939
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The linear Hall IC TLE4997A8D has been specifically designed for highly accurate angle and position detection. The sensor provides a ratiometric analog output voltage, which is ideally suited to Analog-to-Digital (A/D) conversion with the supply voltage as a reference. The IC is produced in BiCMOS technology with high voltage capability and also provides reverse polarity protection. Digital signal processing using a 16-bit DSP architecture together with digital temperature and analog stress compensation guarantees excellent stability over the whole temperature range and life time.
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 9324
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The linear Hall IC TLE4997A is designed for highly accurate angle and position detection. The sensor provides a ratiometric analog output voltage, which is ideally suited to Analog-to-Digital (A/D) conversion with the supply voltage as a reference. The IC is produced in BiCMOS technology with high voltage capability and also provides reverse polarity protection. Digital signal processing using a 16-bit DSP architecture together with digital temperature and analog stress compensation guarantees excellent stability over the whole temperature range and life time.
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 6157
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Solid State Drives - SSD Intel Optane SSD DC P4801X Series (375GB, M.2 110mm PCIe x4, 3D XPoint , 60DWPD) Generic Single Pack
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 7191
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Solid State Drives - SSD Intel Optane SSD DC P4801X Series (200GB, M.2 110mm PCIe x4, 3D XPoint , 60DWPD) Generic Single Pack
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 7305
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Solid State Drives - SSD Intel SSD P4800X Series (375GB, 2.5in PCIe x4, 20nm, 3D XPoint) Generic Single Pack
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 8371
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Q:What defines the physical structure of QFN-16?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connection for low inductance.
- Central thermal pad (4×4 mm coverage): Enhances heat dissipation to the PCB.
- 16-pin layout with perimeter array: Optimizes space efficiency in compact designs.
- 0.9 mm ultra-thin profile: Ideal for height-constrained applications. -
Q:Why choose QFN-16 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than equivalent SOIC packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15°C.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5×5 mm
- Height: 0.9 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is QFN-16 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TI TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., Nordic nRF52840).
- Sensor Interfaces: MEMS accelerometers (e.g., ST LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad void detection.



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