SOT-163-20
- 제품 이미지 & 모델
- 비고
- 단가
- 양
- 운영
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Dual 4-Bit Non-Inverting Buffer/Driver,Buffers & Line Drivers OCTAL BUFF/DRVR 3ST
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1 + 10 + 25 + 50 + >=100 -
1
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Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO T/R
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 2529
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Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO Bulk
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 3807
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Dual 4-Bit Inverting Buffer/Driver,Buffers & Line Drivers OCTAL BUF 3-S (INV)
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1 + 10 + 25 + 50 + >=100 -
1
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3.3 V octal buffer/line driver; 3-state - Description: 3.3V Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2@3.3V ns; Voltage: 2.7-3.6 V,Buffers & Line Drivers 3.3V OCTAL BUF/LDVR NON-INV 3S
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1 + 10 + 25 + 50 + >=100 -
1
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3.3 V octal buffer/line driver; 3-state - Description: 3.3V Octal Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2.6@3.3V ns; Voltage: 2.7-3.6 ,Buffers & Line Drivers 3.3V OCTAL BUF/LDVR NON-INV 3S
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1 + 10 + 25 + 50 + >=100 -
1
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Buffer/Line Driver 8-CH Non-Inverting 3-ST BiCMOS 20-Pin SO T/R
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1900
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3.3 V octal buffer/line driver; 3-state - Description: 3.3V Buffer/Line Driver; Non-Inverting (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: -32/+64 mA ; Propagation delay: 2@3.3V ns; Voltage: 2.7-3.6 V,Buffers & Line Drivers OCTAL BUF/LINE DRVR
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 6000
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Buffer/Line Driver 8-CH Non-Inverting 3-ST BiCMOS 20-Pin SO Bulk
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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Buffer/Line Driver 8-CH Non-Inverting 3-ST BiCMOS 20-Pin SO T/R
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200000
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Buffer/Line Driver 8-CH Non-Inverting 3-ST BiCMOS 20-Pin SO Bulk
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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BUFFER/LINE DRIVER 8-CH INVERTING 3-ST BICMOS 20-PIN SO T/R
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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3.3V Octal buffer/line driver with 30 Ohm series termination resistors; 3-State - Description: 3.3V Buffer/Line Driver; Non-Inverting with 30 Ohm Termination Resistors (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capabi,Buffertar och linjedrivare 3.3V OCTAL BUFFER 3-S 30 OHM
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 2000
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3.3V Octal buffer/line driver with 30 Ohm series termination resistors; 3-State
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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8-Channel Analog Multiplexer/Demultiplexer with Injection-Current Effect Control 16-SOIC -40 to 125
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1282
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Octal buffer/line driver with 5 V tolerant inputs/outputs (3-state) - Description: 3.3V Buffer/Line Driver; Non-Inverting with Bus Hold (3-State) ; Logic switching levels: TTL ; Number of pins: 20 ; Output drive capability: +/- 24 mA ; Power dissipat,Buffers & Line Drivers 3.3V OCTAL 3-S DRVR BUS HOLD
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1974
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Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO T/R
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1521
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Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO Bulk
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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Octal buffer/line driver with 5-volt tolerant inputs/outputs 3-State
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 2575
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Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO T/R
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 14
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Buffer/Line Driver 8-CH Non-Inverting 3-ST CMOS 20-Pin SO Bulk
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 2814
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Q:What defines the physical structure of SOT-163-20?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB integration.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 20-pin layout with dual-row staggered arrangement.
- 0.8 mm ultra-thin profile for space-constrained designs. -
Q:Why choose SOT-163-20 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than SOT-23-6.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0 × 3.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is SOT-163-20 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi FEMs (e.g., SKY66421).
- Sensor Interfaces: MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 µm) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).



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