모든 항목TFBGA-54
- 제품 이미지 & 모델
- 비고
- 단가
- 양
- 운영
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64M-(4M x 16 bit) Synchronous DRAM
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 696
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DRAM Chip SDRAM 256Mbit 16Mx16 3.3V Tray
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1044
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SD 16Mx16 PC166MHz Pb Free
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1100
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SD 16Mx16 PC166MHz Pb Free
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1459
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Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:41; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle,Latches 3.3V ABT 16B Trans D-Type
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1 + 10 + 25 + 50 + >=100 -
1
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Circular Connector; No. of Contacts:3; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:14S; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:14S-1 RoHS Compliant: No,Bus Transceivers 3.3-V ABT 16-Bit Bus Trncvr W/3-St Otpt
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1 + 10 + 25 + 50 + >=100 -
1
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Circular Connector; No. of Contacts:3; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:14S; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:14S-1 RoHS Compliant: No,Buffers & Line Drivers 3.3V ABT 16-Bit Buff/Drv W/3-St Otpt
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1 + 10 + 25 + 50 + >=100 -
1
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3.3-V ABT 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS,Bus Transceivers 8-Bit 2.5/3.3-V Lo-V FET Bus Switch
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1 + 10 + 25 + 50 + >=100 -
1
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3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS,Buffers & Line Drivers 4-Bit One-of-2 FET Mltplxr/Demltplxr
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1 + 10 + 25 + 50 + >=100 -
1
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OSC 200.0000MHZ 2.5V LVDS SMD,Buffers & Line Drivers 3.3V ABT 16-Bit Buff/Drv W/3-St Otpt
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1 + 10 + 25 + 50 + >=100 -
1
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16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS,Bus Transceivers 16-Bit Bus Trnscvr With 3-State Outputs
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1 + 10 + 25 + 50 + >=100 -
1
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16-Bit Buffer/Driver With 3-State Outputs 54-BGA MICROSTAR JUNIOR -40 to 85,Buffers & Line Drivers 16-Bit Buffer/Driver With 3-State Outputs
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1 + 10 + 25 + 50 + >=100 -
1
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16 BIT EDGE TRIGGERED D TYPE FLIP FLOP WITH 3 STATE OUTPUTS,Flip Flops Low-Voltage 4-Bit Mltplxr/Demltplxr
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1 + 10 + 25 + 50 + >=100 -
1
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16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS,Bus Transceivers Lo-Vltg 10-Bit FET Bus-Exchange Switch
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1 + 10 + 25 + 50 + >=100 -
1
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Buffer/Line Driver 16-CH Non-Inverting 3-ST CMOS 54-Pin BGA MICROSTAR JUNIOR T/R
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1 + 10 + 25 + 50 + >=100 -
1
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DRAM 64M (4Mx16) 143MHz SDRAM 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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dram 64m (4mx16) 143mhz automotive temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 210
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DRAM 64M (4Mx16) 166MHz SDRAM 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 64M (4Mx16) 166MHz SDRAM 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 64M (4Mx16) 200MHz Automotive Temp
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1 + 10 + 25 + 50 + >=100 -
1
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DRAM 64M (4Mx16) 200MHz Automotive Temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 20
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DRAM 128M (8Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 128M (8Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 2400
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dram 128m (8mx16) 143mhz industrial temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1024
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DRAM 128M (8Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 144
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DRAM 128M (8Mx16) 133MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 128M (8Mx16) 133MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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dram 128m (8mx16) 133mhz industrial temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 310
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DRAM 128M (8Mx16) 133MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 128M (8Mx16) 166MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 128M (8Mx16) 166MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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dram 128m (8mx16) 166mhz industrial temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1277
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DRAM 128M (8Mx16) 166MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 15
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DRAM 64M (4Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 9217
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dram 64m (4mx16) 143mhz industrial temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 3740
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DRAM 64M (4Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 3200
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DRAM 64M (4Mx16) 166MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 64M (4Mx16) 166MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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dram 64m (4mx16) 166mhz industrial temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 1028
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DRAM 64M (4Mx16) 166MHz SDR SDRAM, 3.3V
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 554
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DRAM 64M (4Mx16) 200MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 64M (4Mx16) 200MHz Industrial Temp
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1 + 10 + 25 + 50 + >=100 -
1
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dram 64m (4mx16) 200mhz industrial temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 210
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DRAM 64M (4Mx16) 200MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 256M (16Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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DRAM 256M (16Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 61
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DRAM 256M (16Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 41
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dram 256m (16mx16) 143mhz industrial temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 181
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dram 256m (16mx16) 143mhz commercial temp
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 517
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DRAM 256M (16Mx16) 143MHz SDRAM, 3.3v
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1 + 10 + 25 + 50 + >=100 -
최소 : 1 재고 : 200
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Q:What defines the physical structure of TFBGA-54?
A:Key features include:
- Leadless bottom-mounted pads for direct PCB attachment.
- Central thermal pad (70% coverage) for enhanced heat dissipation.
- 54-pin layout with a 6×9 matrix arrangement.
- 0.8 mm ultra-thin profile for space-constrained designs. -
Q:Why choose TFBGA-54 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than comparable QFN packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by up to 15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 rating) for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy pads with solder mask-defined (SMD) finish.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is TFBGA-54 typically applied?
A:Dominant use cases:
- Mobile Devices: Power management ICs (e.g., TI TPS65988).
- IoT Modules: Wireless SoCs (e.g., Nordic nRF52840).
- Automotive Electronics: Sensor interfaces (e.g., NXP FXLS8962AF). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 4×4 thermal vias under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 µm) recommended for fine pitch.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory due to hidden solder joints.